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Määrä | |
---|---|
1+ | 1,660 € |
10+ | 1,220 € |
50+ | 1,120 € |
100+ | 0,993 € |
250+ | 0,929 € |
500+ | 0,894 € |
1000+ | 0,865 € |
2500+ | 0,820 € |
Tuotetiedot
Tuotteen yleiskatsaus
MC33662BLEFR2 is a LIN physical layer component IC available in 8 pin NSOIC package dedicated to automotive LIN sub-bus applications. The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required. It offers offer a normal baud rate (20 kbps) and integrate a fast baud rate (above 100 kbps), as reported by the RXD pin for test and programming modes. They provide excellent EMC (Electromagnetic Compatibility) and Radiated Emission performance, ESD (Electrostatic Discharge) robustness, and safe behaviour, in the event of a LIN bus short-to-ground, or a LIN bus leakage during low power mode. This device is powered by SMARTMOS technology.
- Operational from a VSUP of 7 to 18V DC, functional up to 27V DC, and handles 40V during load dump
- Compatible with LIN protocol specification 1.3, 2.0, 2.1 and SAEJ2602-2
- Active bus wave shaping, offering excellent radiated emission performance
- Sustains up to 15KV minimum ESD IEC61000-4-2 on LIN bus, 20KV on WAKE pin and 25KV on VSUP pin
- Very high immunity against electromagnetic interference
- Low standby current in sleep mode
- Over-temperature protection
- Local and remote Wake-up capability reported by the RXD pin
- Fast baud rate selection reported by RXD pin
- 5.0 V and 3.3 V compatible digital inputs without any required external components
Tekniset tiedot
LIN Physical Layer
-
18V
NSOIC
Surface Mount
125°C
-
No SVHC (27-Jun-2024)
-
7V
20Kbaud
8Pins
-40°C
-
MSL 3 - 168 hours
Tekniset asiakirjat (2)
Lainsäädäntö ja ympäristöasiat
Maa, jossa viimeinen merkittävä valmistusvaihe on tehtyAlkuperämaa:United States
Maa, jossa viimeinen merkittävä valmistusvaihe on tehty
RoHS
RoHS
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