640 Voit varata tuotteen varastosta nyt
Määrä | |
---|---|
1+ | 2,220 € |
10+ | 1,620 € |
100+ | 1,310 € |
250+ | 1,250 € |
500+ | 1,180 € |
1000+ | 1,060 € |
Tuotetiedot
Tuotteen yleiskatsaus
The Micro-Fit 3.0 series Connector is a 3mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 8.5A to meet low- to mid-range power application needs. Molex's Micro-Fit 3.0 interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centreline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. These can be purchased in pure tin or one of two thicknesses of select gold. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects.
- Fully isolated contacts
- Full polarization
- Positive locks
- UL94V-0 flammability rating
Sovellukset
Alternative Energy, Automotive, Communications & Networking, Consumer Electronics, Medical, Industrial
Tekniset tiedot
Power
1Rows
Surface Mount Right Angle
Shrouded
Gold Plated Contacts
No SVHC (21-Jan-2025)
3mm
2Contacts
Micro-Fit 3.0 43650
Brass Alloy
PCB Header
Vaihtoehdot osanumerolle 43650-0213
6 tuotetta löydetty
Liitännäistuotteet
1 tuote löytyi
Lainsäädäntö ja ympäristöasiat
Maa, jossa viimeinen merkittävä valmistusvaihe on tehtyAlkuperämaa:Mexico
Maa, jossa viimeinen merkittävä valmistusvaihe on tehty
RoHS
RoHS
Tuotteen vaatimustenmukaisuustodistus