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Product Information
ManufacturerFISCHER ELEKTRONIK
Manufacturer Part NoICK BGA 23X23
Order Code1211702
Technical Datasheet
Thermal Resistance23°C/W
Packages CooledBGA, PLCC
External Width - Metric23mm
External Height - Metric6mm
External Length - Metric23mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Width - Imperial0.91"
External Height - Imperial0.24"
External Length - Imperial0.91"
External Diameter - Imperial-
Product Range-
SVHCNo SVHC (21-Jan-2025)
Product Overview
The ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors.
- 1.8mm Plate thickness
Applications
Industrial
Technical Specifications
Thermal Resistance
23°C/W
External Width - Metric
23mm
External Length - Metric
23mm
Heat Sink Material
Aluminium
External Height - Imperial
0.24"
External Diameter - Imperial
-
SVHC
No SVHC (21-Jan-2025)
Packages Cooled
BGA, PLCC
External Height - Metric
6mm
External Diameter - Metric
-
External Width - Imperial
0.91"
External Length - Imperial
0.91"
Product Range
-
Technical Docs (1)
Associated Products
1 Product Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
Tariff No:76169990
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.003175