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CCI11
Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm
Image is for illustrative purposes only. Please refer to product description.
No Longer Manufactured
Product Information
ManufacturerCCI
Manufacturer Part NoCCI11
Order Code1373300
Technical Datasheet
Thermal Resistance9.38°C/W
Packages CooledBGA
External Width - Metric40mm
External Height - Metric5mm
External Length - Metric40mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Width - Imperial1.57"
External Height - Imperial0.2"
External Length - Imperial1.57"
External Diameter - Imperial-
Product Range-
Product Overview
The CCI11 is a 5 x 40 x 40mm double sided adhesive BGA Heat Sink made of aluminium body. The double sided adhesive provides simple and effective attachment. This heat sink is used for a variety of applications requiring simple extension of surface area for cooling and typically used with DSP, FPGAs and other electronics packages.
Applications
Industrial
Technical Specifications
Thermal Resistance
9.38°C/W
External Width - Metric
40mm
External Length - Metric
40mm
Heat Sink Material
Aluminium
External Height - Imperial
0.2"
External Diameter - Imperial
-
Packages Cooled
BGA
External Height - Metric
5mm
External Diameter - Metric
-
External Width - Imperial
1.57"
External Length - Imperial
1.57"
Product Range
-
Technical Docs (2)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:76169990
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.012