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BGA-FC-010
Heat Sink, For Ball Grid Array, Flip-Chip, 13.5 °C/W, BGA, 40 mm, 10 mm, 40 mm
Image is for illustrative purposes only. Please refer to product description.
No Longer Manufactured
Product Information
ManufacturerABL HEATSINKS
Manufacturer Part NoBGA-FC-010
Order Code2084414
Technical Datasheet
Thermal Resistance13.5°C/W
Packages CooledBGA
External Width - Metric40mm
External Height - Metric10mm
External Length - Metric40mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Width - Imperial1.57"
External Height - Imperial0.39"
External Length - Imperial1.57"
External Diameter - Imperial-
Product Range-
SVHCNo SVHC (17-Jan-2023)
Technical Specifications
Thermal Resistance
13.5°C/W
External Width - Metric
40mm
External Length - Metric
40mm
Heat Sink Material
Aluminium
External Height - Imperial
0.39"
External Diameter - Imperial
-
SVHC
No SVHC (17-Jan-2023)
Packages Cooled
BGA
External Height - Metric
10mm
External Diameter - Metric
-
External Width - Imperial
1.57"
External Length - Imperial
1.57"
Product Range
-
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Great Britain
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Great Britain
Country in which last significant manufacturing process was carried out
Tariff No:76041090
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.0168