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50+ | € 2.860 |
100+ | € 2.360 |
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Product Information
ManufacturerBOYD
Manufacturer Part No374124B00035G
Order Code1611436
Technical Datasheet
Thermal Resistance23.4°C/W
Packages CooledBGA
External Width - Metric23mm
External Height - Metric18mm
External Length - Metric23mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Width - Imperial0.91"
External Height - Imperial0.71"
External Length - Imperial0.91"
External Diameter - Imperial-
Product Range-
Product Overview
The 374124B00035G is a clear/silver pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.
- Tape mounting saves board space by eliminating mounting holes
- Convenient peel and stick assembly is quick and clean
- Pin-fin array allows omnidirectional airflow to maximize heat dissipation
- Comes with T411 Chomerics tape for all surfaces
- Silicone adhesive
Applications
HVAC, Thermal Management
Technical Specifications
Thermal Resistance
23.4°C/W
External Width - Metric
23mm
External Length - Metric
23mm
Heat Sink Material
Aluminium
External Height - Imperial
0.71"
External Diameter - Imperial
-
Packages Cooled
BGA
External Height - Metric
18mm
External Diameter - Metric
-
External Width - Imperial
0.91"
External Length - Imperial
0.91"
Product Range
-
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Tariff No:76169990
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.005925