Quick charging and compact size are the key customer-driven trends in the charger and adapter industry.
For the end user reduction of clutter, ease-of-use, and a well-balanced performance-cost-ratio are additional decisive factors for purchasing decisions. On the manufacturing side, these require smaller form factors, maximized power density, and unification enabled by the so-called USB-PD protocol as basis for increased power levels from existing USB standards. This will allow to charge not only smartphones but also power hard drives, printers, displays, and larger portable electronics like laptops. The maximum 100 W power supply is achieved with 20 V and up to 5 A.
Power management optimization across multiple peripherals

In addition to faster charging, this USB standard enables both, host and peripheral devices, to provide power - the power direction is no longer fixed. Essential is the communication of a suitable “power rule”, i.e. the source and the host exchange their requirements to figure out how much power to transfer. In this way, power management across multiple peripherals is optimized. Each device is supplied only the power it requires (e.g. low power cases such as headsets vs. a laptop being a high power case).
To ensure that design engineers are able to meet their design targets, Infineon offers a comprehensive semiconductor portfolio of low RDS(on) high-voltage and low-voltage power MOSFETs that accommodate excellent power density while appropriately addressing thermal management and potential EMI issues. Boards and magnetics are automatically assembled.
The focus on SMD packages results in fewer external components as well as in improved production performance related cost savings. With planar transformers and soft-switching control, customers can easily come up with slim designs. Digital-based control allows customers to differentiate substantially. Infineon paves the way in developing several high-performance USB PD solutions (e.g., a ready-to-use USB PD 45 W reference design).
Featured products
XDPS21071 - XDPTM Digital forced- frequency-resonant (FFR) flyback controller

The XDPS21071 is a digital PWM controller for high-density charger and adapter applications based on the DCM flyback topology. A wide feature set is provided in a DSO-12 package. Only a minimum of external components is required. An integrated ASSP digital engine provides advanced algorithms for multi-mode operation and protection functions. Special analog and mixed-signal peripherals are integrated to support the requirements for low stand-by power. The forced frequency resonant (FFR) operation facilitates an optimized high-density charger and adapter system dimensioning. The IC supports the highest design flexibility in the application by means of an advanced set of configurable parameters and state machines.
Shop NowXDPS21071 based 45 W ultra-high power density charger (45 W USB-PD 3.0 Type C charger)

The ready to use 45 W USB-PD digital reference design offers a robust, high power density, low cost, and productive solution. Thanks to the forced frequency resonant provided by the new digital PWM controller, XDPS21071, in combination with the proven CoolMOSTM as well as OptiMOSTM technologies featuring outstanding performance, a power density >20 W/in3 (50CC) can be achieved.
Shop Now600 V CoolMOSTM PFD7 – Challenges known MOSFET efficiency and density levels

Comparing the newly launched CoolMOSTM PFD7 with its existing CoolMOSTM P7 technology, Infineon highlights an efficiency increase of up to 1.17%. The mentioned efficiency increase at peak-power results in a rise in power density of up to 1.8 W/in³! At the same power level, PFD7 enables a 5°C lower case temperature. Additionally, the 600 V CoolMOSTM PFD7 features >20% Eoss reduction compared to CoolMOSTM P7 at partial ZVS turn-on voltages. Optimized switching technology parameters militate in favor of the newly released MOSFET family, too.
CoolMOSTM PFD7 pushes the SJ MOSFET technology to new limits! Customers will benefit from an outstanding reduction of conduction, charge/discharge, turn-off, and gate-driving losses. Furthermore, an integrated ESD protection of up to 2kV eliminates ESD related yield loss.
700 V CoolMOSTM P7 – A high-voltage switch

The 700 V CoolMOSTM P7 offers a price competitive solution for consumer applications such as chargers and adapters in the power range from 10 W to 75 W. In other words, this product addresses the low-power SMPS market where it tackles common barriers through excellent performance and ease-of-use. The named power converters are typically based on flyback topologies. That is why the 700 V CoolMOSTM P7 is no longer a multi-purpose MOSFET, it is now a tailored technology optimized for flyback topologies.
The 700 V CoolMOSTM P7 is available in the cost-effective SOT-223 package, the perfect drop-in replacement as it fits to common DPAK properties (i.e. smaller footprint while DPAK pin-to-pin compatible) and reduces the overall bill of material (BOM). Improved form factors enable space savings without a significant disadvantage in thermals. The CoolMOSTM P7 in SOT-223 is Infineon’s contribution to the design of competitive products that match the increasing demand for compact, light and slim low power SMPS designs
CoolMOSTM in ThinPAK 8x8 – Enabling high-density charger / adapter designs

Silicon technologies like CoolMOSTM have reached such an advanced stage of fast and efficient switching that the traditional through-hole packages more and more have become the limiting factor in getting to the next level of energy efficiency and power density. Designers need to balance the power handling capability and package size when selecting high-voltage MOSFETs for a dense charger design. Infineon’s engineers recommend turning to ThinPAK 8x8 - a leadless SMD package for HV MOSFETs - as ideal solution. It has a remarkably small footprint of only 64 mm² (vs. 150 mm² for the D2PAK) and a very low profile with only 1 mm height (vs. 4.4 mm for the D2PAK). These differentiating measurements in combination with benchmark low parasitic inductances, provide designers with a new and effective way to decrease system solution size in power density driven designs.
Shop NowOptiMOSTM PD (Power Delivery) – Low- and medium-voltage MOSFET portfolio for charger and adapter designs (25 V – 150 V)

OptiMOSTM PD is Infineon‘s new power MOSFET portfolio representing the best fit for USB-PD and fast charger designs, supporting short lead times as well as fast quote response times. The logic level OptiMOSTM PD power MOSFETs in PQFN 3.3 x 3.3 and in SuperSO8 packages have been optimized for synchronous rectification in charger and adapter SMPS applications. Hence, they are highly suitable for addressing the requirements of USB PD charger and adapter designs. Small package sizes translate into shrunk form factors. Lower charges for reduced switching losses and an excellent price/performance ratio lead to system BOM cost improvements. The logic level drive provides a low gate threshold voltage (VGS(th)) allowing the MOSFETs to be driven from 4.5 V or directly from microcontrollers leading to a lower part count in the application. Low reverse-recovery charge (Qrr) and output charge (Qoss) yield low overshoot in synchronous rectification.
Shop NowWhy USB PD solutions from Infineon?
High power density
- Digital forced frequency resonant control and high performance CoolMOSTM P7 and OptiMOSTM PD -> achieving over 22 W/inch3 uncased power density
- High efficiency enabling smaller form factors
- SMD packaged power components combined with optimized planar transformer -> for slim design
Short time to market
- Extensive application system understanding -> readily available and easy-to-use solutions optimized for application-specific requirements
- Provided hardware/software design tools can help diversify customer designs
- Solution reliability proven by leading customers reduces risk qualification time
- Broad network of field application engineers and partners ensures effective support globally
- One-stop shop -> sourcing the most important semiconductors for USB PD from one single supplier
Competitive cost
- Leading-edge technologies and packages reduce external costs (e.g. for thermal management)
- Dedicated charger orientated portfolio with optimized cost
- One-stop-shop -> likely to result in commercial cost savings
- Various factors to bring system cost down -> e.g. reducing complexity and size, enabling specific transformer usage, optimizing production cost, etc.
High differentiation
- Digital solution -> facilitating maximum differentiation
Secured supply chain
- Flexible supply chain can shorten lead times and allow customers to adjust to changing demands in consumer markets
- Large production capacity to secure upsurge in demand -> 3 front-end sites and over 5 back-end plants for power MOSFETs